Below you will find a selection of the tools provided by CHA Industries. The product line consists of high vacuum deposition systems and associated equipment for precision coating. A full list of all available tools is available through the following link.
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 CHA’s new SOLUTION™ Process Development System is a small-scale vacuum deposition system designed for small lot processing (at universities, R&D labs, etc.). While compact in size at 48.15"D x 46"W x 78.68"H, the SOLUTION™ system has many of the high-performance features as found in CHA’s large-scale Mark 40 and Mark 50 PVD systems, like a fully water-cooled stainless steel chamber for optimizing process start temperatures. |
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 CHA Mark 50 Systems have become the industry standard for high vacuum deposition systems. Simplicity in design, ease of operation and unmatched reliability make the Mark 50 an excellent choice for a wide range of applications. The Mark 50's horizontal 32" by 32" water-cooled cylindrical chamber simplifies loading and unloading. The unique slide down front door minimizes floor space requirements and a rear door offers easy chamber access from behind for convenient through the wall mounting.
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 Combining the best features of CHA Industries' Mark 50 system with a broad array of options, the innovative Mark 40 represents a distinct breakthrough in vacuum deposition system efficiency, flexibility and ease of maintenance. The Mark 40 accommodates a wide variety of deposition equipment, including versatile combinations of deposition sources and substrates fixturing to address virtually any application.
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 CHA's multi-process high vacuum Web/Roll Coating system is designed to coat Mylar, foil, flexible circuits and other thin plastic or metallic materials stored in continuous roll form. Typical process stations within the high vacuum chamber can include sputtering cathodes, electron beam guns, thermal sources, substrate heat, ion beam sources and Plasma Process Bar.
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 The SE-600's 6-inch, high-speed diffusion pump delivers a pumping speed of 2400 l/s. Like all SE/SEC-Series systems, the baseplate (typically 20 inches) accommodates up to 15 feedthroughs for instrumentation, control and rotary motion. SE-600 systems are most often equipped with a 19.5-inch diameter bell jar and Planetary Fixturing having a capacity of 18 4-inch wafers. The average pumpdown time of less than 30 minutes allows throughput in excess of 54 wafers per hour. |
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SEC-1000-RAP & SE-1000-RAP |
 The largest of the SE/SEC-Series, the SE-1000 has a 10-inch diffusion pump rated at 5300 l/s, and is typically equipped with a 25.5-inch diameter, water-cooled bell jar, a 26-inch diameter stainless steel baseplate, and Planetary Fixturing holding up to 36 4-inch wafers. One Button Automation and Lift-Off Fixturing are among the most popular options added to the system. |
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 The SSC-600 (6") Sputtering System incorporates upper and lower base plates for sputter up or sputter down operation. Substrates and stations are accessible from the top or bottom of the process chamber. Lower baseplate swings out for access through cabinet doors. Upper baseplate is elevated for substrate access and may be rotated outward for station access. |
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 The SSC-1000 (10") Sputtering System incorporates upper and lower base plates for sputter up or sputter down operation. Base plates move out of cabinet doors allow for through-the-wall mounting of the system. |
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 CHA 635 Modular Deposition Systems provide the utmost in versatility and scalability for both sputtering and evaporation applications. The systems allow you to add capability and capacity as you need it with numerous options, such as a class 10 mini-environment and AGV compliant cassette-to-cassette robotic wafer handling. Each system includes touch screen PLC control and an intuitive Wonderware GUI. |
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 CHA's Production Box Coater is designed for precision coating of a wide variety of sizes and shapes of parts fabricated from glass, metal, plastics and other industrial materials. Capable of sequential or co-evaporation from up to four electron beam guns, the CHA Box Coater can also incorporate thermal and ion beam sources. |
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 The MPS-4 is designed for side sputtering operation with up to four DC or RF cathodes. The system features 360° substrate heating and rotating shutters for positive thickness cutoff control. Standard system fixturing consists of a dual drive planetary. The orbit drive allows substrates to pass through the deposition zone or to be stopped in front of or near any cathode while the substrate spins on it's own axis. |
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